COG LCMs utilize a high-precision chip-bonding process where the driver IC is mounted directly on the glass substrate. This advanced structure results in ultra-slim modules with superior mechanical stability and reduced power consumption. Jinrun specializes in developing custom COG LCDs for compact or portable equipment, including wearable devices, handheld meters, UAV controllers, and smart medical instruments. We offer fine-pitch bonding, low-voltage driving, flexible FPC layouts, and custom shapes tailored to customer specifications. With more than a decade of experience in COG process control, we ensure excellent bonding reliability, minimal signal interference, and enhanced optical clarity, making COG modules ideal for next-generation smart devices.
